Apparatus and methods for improving uniform cover tape adhesion on a carrier tape

ABSTRACT

Apparatus and methods are presented herein for uniformly sealing and peeling a cover tape to/from a carrier tape. The carrier tapes of the present invention include surface transitions that minimizes/eliminates surface irregularities and distortions such that the cover tapes can be uniformly sealed and peeled from the carrier tapes. The surface transitions act as physical barriers to prevent propagation of surface irregularities and distortions from the thermoformed pocket area into the heat bonding zones. The surface transitions also act as stiffening members to keep the heat bonding zones as flat as possible during subsequent handling of the carrier tape. The surface transitions may be in the form of continuous or intermittent ribs, step portions, or single or double sided grooves. Depressed portions in between the pockets can also be used to minimize the presence of surface distortions on the bonding zones.

CROSS REFERENCE TO RELATED APPLICATION

[0001] This application is a continuation in part of application Ser.No. 09/484,380, filed Jan. 14, 2000.

FIELD OF THE INVENTION

[0002] The present invention relates to a carrier tape system used forpackaging, transporting, and automatically taking out components thatare placed in the pockets of a carrier tape. More particularly, thepresent invention is directed to apparatus and methods for uniformlysealing and peeling a cover tape that is used to protect the componentsplaced in the pockets of the carrier tape. Furthermore, the presentinvention provides apparatus and methods for minimizing or eliminatingsurface irregularities and distortions on bonding zones of the carriertape.

BACKGROUND OF THE INVENTION

[0003] Electronic components such as semiconductor chips, devices,integrated circuits, and the like are generally developed andmanufactured by one manufacturer and transported to another manufactureror customer for further processing. For example, after manufacturingsemiconductor chips in a fabrication or “clean room” facility, the chipsare generally packaged and transported to another manufacturer orcustomer, for example, a computer wholesaler, so that the wholesaler canmount them to printed circuit boards or the like.

[0004] When components are packaged and transported from onemanufacturer to another, it is critical that the components be packagedand transported with minimal damage. By their very nature, smallelectronic components (e.g., semiconductor chips, devices, andintegrated circuits) are light-weight objects and susceptible to damage.Thus, it is important that these components be packaged and transportedin a manner that minimizes/eliminates damage to them.

[0005] Currently, the semiconductor fabrication industry implements aJEDEC standard carrier tape system to package and transportsemiconductor components. Conventional carrier tape systems allow thecomponent manufacturers to package and transport the components to theircustomers with minimal damage while allowing the customers toefficiently unload the components using an automated pick and placemachine.

[0006] FIGS. 1A-1C illustrate various views of a conventional carriertape system. For example, FIG. 1A illustrates a perspective view, FIG.1B illustrates a top view, and FIG. 1C illustrates a cutaway end view ofa section taken along line A-A of the conventional carrier tape system.Reference will be made to FIGS. 1A-1C concurrently for a more completeunderstanding of the conventional system.

[0007] A conventional carrier tape 2 includes multiple thermoformedpockets 4 formed along its longitudinal direction for storing individualcomponents 6. The carrier tape 2 also includes a row of advancementholes 8 formed longitudinally along one side of the carrier tape 2. Theadvancement holes 8 are used for locating and feeding the components 6into the automated pick and place machine (not shown).

[0008] In conventional carrier tape systems, surface irregularities anddistortions are typically formed on the top surface of the carrier tape2. These surface irregularities and distortions have a significantinfluence on the uniformity of the bonding strength between the carriertape 2 and the cover tape 10. Surface irregularities and distortions aregenerally formed on the carrier tape 2 as a result of thermoforming thepockets 4 or from subsequent handling of the carrier tape 2. Suchsurface irregularities and distortions may be in a form of small bumps14 or grooves 16, which propagate out from or between the pockets 4.

[0009] During the packaging process, the components 6 are loaded intothe pockets 4 of the carrier tape 2. After the components 6 aresuccessfully loaded into the pockets 4, a cover tape 10 is applied overthe pockets 4 using, for example, a sealing iron (not shown) to securethe components 6 contained therein. The cover tape 10 protects andretains the components 6 in the pockets 4 of the carrier tape 2. Ingeneral, the cover tape 10 is heat bonded over the carrier tape 2 alonga pair of bonding portions 12. In other words, only the outer portions(corresponding to bonding portions 12) of the cover tape 10 are heatbonded to the carrier tape 2 along the longitudinal direction.

[0010] After sealing the pockets 4 of the carrier tape 2 with the covertape 10, the components 6 are transported to anothermanufacturer/customer. After receiving the carrier tape 2, it is fedinto the pick and place machine along its longitudinal direction usingadvancement holes 8. The cover tape 10 is simultaneously peeled/removedfrom the carrier tape 2. Thereafter, the components 6 in the pockets 4of the carrier tape 2 are taken out and mounted to printed circuitboards or the like.

[0011] An important consideration using the heat bonding process asdescribed above is that the cover tape 10 must be peeled back from thecarrier tape 2 with a uniform amount of force before the components 6are taken out of the pockets 4. In other words, while separating thecover tape 10 from the carrier tape 2, the force required for suchseparation should be constant with respect to the longitudinal directionof the carrier tape 2. However, because of surface irregularities anddistortions, the required separation force may not be constant. Forexample, a greater force may be required to separate the cover tape 10from the carrier tape 4 where there are “high spots” (i.e., bump 14 ofFIG. 1C) and a smaller force may be required in regions where there arelower spots. As a result, the force needed to separate/peel the covertape 10 from the carrier tape 2 may not be uniform from one region toanother. Undulations may result in the carrier tape 2 as the cover tape10 is separated/peeled. Such undulations may undesirably separate thecomponents 6 from the pockets 4 of the carrier tape 2 or change theplacement of the components 6, thereby leading to obstructions in usingthe automated pick and place machine.

[0012] Small surface irregularities and distortions as described abovecan cause differences in contact pressure during the heat bondingprocess. As the cover tape 10 is sealed to the carrier tape 2 on thebonding portions 12, “high spots” will tend to bond better than lowerspots, thereby causing variations in the bonding strength. Achievinguniform release tension is often very difficult when such variations inthe bonding strength exists and continues to be a major problem in thecarrier tape industry.

[0013]FIG. 2A illustrates a top view and FIG. 2B illustrates an explodedtop view of a section of another conventional carrier tape. Similar tothe carrier tape 2 of FIGS. 1A-1C, the carrier tape 22 includes multiplethermoformed pockets 24 for storing components and advancements holes 28for the automated pick and place machine. As shown in more detail,surface distortions 26 are formed on the carrier tape 22 fromthermoforming the pockets 24 and/or subsequent handling the carrier tape22. Such distortions 26 propagate to the heat bonding portions, therebyrequiring variations in the force needed to remove the cover tape fromthe carrier tape 22.

[0014] The carrier tape is made generally made from, but not limited to,thermoplastic resin, polystyrene or ABS (acrylonitrilebutadiene-styrene) with or without additives, and the cover tape is madefrom, but not limited to, polyester, polypropylene or polyethylenehaving heat sensitive adhesives with or without additives.

[0015] U.S. Pat. No. 4,736,841 ('841 patent) also discloses variousexamples of other prior art carrier tape systems. One particularembodiment in the '841 patent includes a carrier tape that has a pair ofstep portions extending longitudinally along opposite sides of thecarrier tape. The raised portions of the carrier tape are used asbonding portions to heat bond the cover tape thereto, where the stepportions are also used as boundaries for applying the cover tape.Consequently, a recessed center portion is prevented from making contactwith the cover tape as the step portions are used as physicalboundaries. Thus, in this particular prior art embodiment, theboundaries of each of the bonding portions are defined by the stepportions, which extend longitudinally along the carrier tape. Inaddition, the '841 patent does not address the problem ofminimizing/eliminating surface irregularities and distortions in thebonding portions/zones of the carrier tape.

SUMMARY OF THE INVENTION

[0016] It is an object of the present invention to provide apparatus andmethods for improving adhesion between a carrier tape and a cover tape.

[0017] It is another object of the present invention to provideapparatus and methods for providing a more uniform sealing and peelingprocess between a cover tape and a carrier tape.

[0018] It is a further object of the present invention to provideapparatus and methods for minimizing/eliminating surface irregularitiesand distortions from the bonding portions/zones of a carrier tape.

[0019] It is yet another object of the present invention to provideapparatus and methods for improving cover tape bond strength uniformity.

[0020] It is another object of the present invention to provide acarrier tape having surface transitions along each longitudinal side tominimize/eliminate surface irregularities and distortions on the bondingportions/zones of the carrier tape.

[0021] It is still another object of the present invention to provide acarrier tape having depressed portions in between the pockets.

[0022] The present invention relates to apparatus and methods forsealing and peeling a cover tape from a carrier tape in a uniformmanner. The carrier tapes of the present invention include surfacetransitions that minimizes/eliminates the presence of surfaceirregularities and distortions on the carrier tape such that the covertape can be uniformly applied and removed to/from the carrier tape.These surface transitions are used to improve bond strength uniformitybetween the cover tape and the carrier tape.

[0023] Apparatus and methods for minimizing/eliminating the presence ofsurface irregularities and distortions in bonding zones of the carriertape is achieved by adding surface transitions along each longitudinalside of the carrier tape. This can be accomplished by adding a pair ofcontinuous or intermittent ribs or step portions between the pockets andthe heat bonding zones. In other embodiments, there can be more than twosurface transitions on the carrier tape (i.e., four continuous ribs, twocontinuous ribs on each side of the carrier tape extendinglongitudinally). The surface transitions act as physical barriers toprevent propagation of surface irregularities and distortions from thethermoformed pocket area to the heat bonding zones. In addition, thesurface transitions also act as stiffening members to help keep the heatbonding zones as flat as possible during subsequent handling of thecarrier tape.

[0024] In yet another preferred embodiment of the present invention, thecarrier tape includes depressed portions in between the pockets andextending longitudinally along the carrier tape. The depressed portionscan be formed at or within the pocket boundaries.

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] These and other objects and advantages of the present inventionwill become apparent and more readily appreciated from the followingdetailed description of the presently preferred exemplary embodiments ofthe invention taken in conjunction with the accompanying drawings, ofwhich:

[0026]FIG. 1A illustrates a perspective view of a conventional carriertape system;

[0027]FIG. 1B illustrates a top view of a conventional carrier tapesystem as shown in FIG. 1A;

[0028]FIG. 1C illustrates a cutaway end view of a conventional carriersystem as shown in FIG. 1A;

[0029]FIG. 2A illustrates a top view of another conventional carriertape;

[0030]FIG. 2B illustrates an exploded top view of a section of theconventional carrier tape of FIG. 2A;

[0031]FIG. 3A illustrates a top perspective view of a carrier tape andcover tape in accordance with the first preferred embodiment of thepresent invention;

[0032]FIG. 3B illustrates a bottom perspective view of a carrier tape inaccordance with the first preferred embodiment of the present invention;

[0033]FIG. 3C illustrates a side view of a carrier tape and cover tapein accordance with the first preferred embodiment of the presentinvention;

[0034]FIG. 3D illustrates a cutaway top view of a carrier tape and covertape in accordance with the first preferred embodiment of the presentinvention;

[0035]FIG. 3E illustrates a cutaway end view of a section of a carriertape and cover tape in accordance with the first preferred embodiment ofthe present invention;

[0036]FIG. 3F illustrates another top view of a carrier tape and covertape in accordance with the first preferred embodiment of the presentinvention;

[0037]FIG. 3G illustrates a cutaway end view of a cross section takenalong line I-I of FIG. 3F;

[0038]FIG. 3H illustrates a cutaway end view of a cross section takenalong line II-II of FIG. 3F;

[0039]FIG. 31 illustrates an exploded view of a surface transition inaccordance with the first preferred embodiment of the present invention;

[0040]FIG. 4A illustrates a top perspective view of a carrier tape andcover tape in accordance with the second preferred embodiment of thepresent invention;

[0041]FIG. 4B illustrates a bottom perspective view of a carrier tape inaccordance with the second preferred embodiment of the presentinvention;

[0042]FIG. 4C illustrates a side view of a carrier tape and cover tapein accordance with the second preferred embodiment of the presentinvention;

[0043]FIG. 4D illustrates a top view of a carrier tape and cover tape inaccordance with the second preferred embodiment of the presentinvention;

[0044]FIG. 4E illustrates a cutaway end view of a cross section takenalong line III-III of FIG. 4D;

[0045]FIG. 4F illustrates a cutaway end view of a cross section takenalong line IV-IV of FIG. 4D;

[0046]FIG. 5A illustrates a bottom perspective view of a carrier tape inaccordance with the third preferred embodiment of the present invention;

[0047]FIG. 5B illustrates a top perspective view of a carrier tape inaccordance with the third preferred embodiment of the present invention;

[0048]FIG. 6 illustrates a top perspective view of a carrier tape inaccordance with the fourth preferred embodiment of the presentinvention;

[0049]FIG. 7 illustrates an exploded view of a surface transition inaccordance with the another preferred embodiment of the presentinvention; and

[0050] FIGS. 8A-8C illustrate exploded views of surface transitions inaccordance with yet other preferred embodiments of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0051] The present invention will be described in greater detail, whichmay serve to further the understanding of the preferred embodiments ofthe present invention. As described elsewhere herein, variousrefinements and substitutions of the various embodiments are possiblebased on the principles and teachings herein.

[0052] The preferred embodiments of the present invention will now bedescribed with reference to FIGS. 3-8, wherein like components aredesignated by like reference numerals throughout the various figures.Further, specific details and parameters are provided herein, and areintended to be explanatory rather than limiting.

[0053] The present invention discloses apparatus and methods forminimizing and/or eliminating surface irregularities and distortions ona carrier tape, particularly in the bonding portions/zones of thecarrier tape. Surface transitions are formed longitudinally on the sidesof the carrier tape, either continually or intermittently, therebypreventing surface irregularities and distortions from being formed onthe bonding portions/zones. As a result, a cover tape can be removedfrom the carrier tape using a substantially uniform tape release tensiondue to the minimal presence of surface irregularities and distortions onthe bonding zones.

[0054] In one embodiment of the present invention, surface transitionsinclude a pair of continuous ribs that are formed along the longitudinalsides of the carrier tape. In another embodiment of the presentinvention, a pair of step portions are formed along the longitudinalsides of the carrier tape. In yet another embodiment, depressed portionsare formed in between the pockets longitudinally along the carrier tape.In all the embodiments, surface irregularities and distortions areminimized/eliminated in the bonding zones of the carrier tape.

[0055] FIGS. 3A-3I illustrate a first preferred embodiment of thepresent invention. FIG. 3A illustrates a perspective top view, FIG. 3Billustrates a perspective bottom view, and FIG. 3C illustrates a sideview of a carrier tape 102 and cover tape 110 in accordance with thefirst preferred embodiment. The carrier tape 102 includes multiplethermoformed pockets 104 for storing and transporting the components106. Although each pocket 104 generally stores and transports one suchcomponent 106, in other embodiments, each pocket 104 can store andtransport two or more components 106. Along the longitudinal directionof the carrier tape 102, there are also formed advancement holes 108. Asdescribed in the background section, these advancement holes 108 areused by an automated pick and place machine in order to pick up thecomponents 106 from/into the pockets 104.

[0056] The carrier tape 102 further includes a pair of continuous ribs120 where each continuous rib extends longitudinally along two sides ofthe carrier tape 102. When such ribs 120 are present, surfaceirregularities and distortions are minimized/eliminated in the bondingzones of the carrier tape, as described in more detail later herein.

[0057]FIG. 3D illustrates a cutaway top view and FIG. 3E illustrates acutaway end view of a section of a carrier tape 102 and cover tape 110in accordance with the first preferred embodiment of the presentinvention. The cover tape 110 is heat bonded to the carrier tape 102along the heat bonding zones 130 (i.e., crossed-hatched area) using aconventional iron (not shown). Each of the two continuous ribs 120 isformed and extends longitudinally in between the pockets 104 and theheat bonding zones 130. The continuous ribs 120 may be formed havingindents (spoon-like configuration) facing upwards, as shown in FIGS.3A-3H, or in the alternative, continuous ribs may be formed such thatthe indents are facing downwards. In other words, the continuous ribs120 as shown in FIGS. 3A -3H can be “flipped” 180 degrees such that theindents are facing downwards, instead of upwards.

[0058] When surface irregularities and distortions are formed on thecarrier tape 102, the continuous ribs 120 acts as physical barriers bypreventing these surface irregularities and distortions from spreadingto the bonding zones 130. In this manner, the surface irregularities anddistortions are contained within the center portion of the carrier tape102. It is also noteworthy to note that the bonding zones 130 aretypically narrower than the contact area between the cover tape 110 andcarrier tape 102. For example, in the current carrier tape industry, thewidth of each bonding zone 130 is generally about 0.5 mm.

[0059]FIG. 3F illustrates another top view of a carrier tape 102 inaccordance with the first preferred embodiment of the present invention.FIG. 3F is illustrated herein to further show cutaway cross sectionalviews taken along lines I-I and II-II for a more complete understandingof the present invention. For example, FIG. 3G and FIG. 3H illustratecutaway end views of cross sections taken along lines I-I and linesII-II, respectively. Also, FIG. 3I illustrates an exploded view of thecontinuous ribs 120 in accordance with the first preferred embodiment ofthe present invention. Again, the continuous ribs 120 are formed inbetween the pockets 104 and the bonding zones 130.

[0060] In another embodiment, instead of using the radius ribs 120, ribscan be formed in a rectangular manner. FIG. 7 illustrates a rectangularrib 710 that can be used as an alternative to the radius ribs 120. Itcan be appreciated that one skilled in the art can modify the variousteachings herein to come up with alternative designs or configurationsof the surface transitions. For example, FIGS. 8A-8C illustrate explodedviews of surface transitions in accordance with other preferredembodiments of the present invention. The surface transitionsillustrated in FIGS. 8A-8C are known as single sided or “groove”transitions since they modify only the top surfaces of the carriertapes. These groove transitions can be a single sided radius groove 810(FIG. 8A), single sided rectangular groove 820 (FIG. 8B), or multiplegrooves 830 (FIG. 8C).

[0061] In other embodiments, more than two continuous ribs (i.e., four,five, six, etc.) may be used as surface transitions on the carrier tapeto prevent surface irregularities and distortions from forming on thebonding zones. For example, two pairs of continuous ribs, for a total offour continuous ribs, may be formed on the carrier tape. In this manner,one pair of continuous ribs may be formed longitudinally along one sideof the carrier tape, while another pair of continuous ribs may be formedon the other side of the carrier tape.

[0062] FIGS. 4A-4F illustrate a second preferred embodiment of thepresent invention. FIG. 4A illustrates a perspective top view, FIG. 4Billustrates a perspective bottom view, and FIG. 4C illustrates a sideview of a carrier tape 202 and cover tape 210 in accordance with thesecond preferred embodiment. Again, the carrier tape 202 includesadvancement holes 208 and multiple pockets 204 for storing andtransporting the components 106.

[0063] In the second embodiment of the invention, the carrier tape 202includes a pair of step portions 220, as opposed to ribs 120, extendinglongitudinally along the two sides of the carrier tape. When such stepportions 220 are used, surface irregularities and distortions areminimized/eliminated in the bonding zones of the carrier tape in amanner similar to that described above.

[0064]FIG. 4D illustrates a top view of the carrier tape and cover tapein accordance with the second preferred embodiment of the presentinvention. Referring to FIG. 4D, cutaway cross sectional views takenalong lines III-III and IV-IV are illustrated in FIGS. 4E and 4F,respectively, for a more complete understanding of the presentinvention.

[0065] Again, in other embodiments, more than two step portions may beused as surface transitions on the carrier tape to prevent surfaceirregularities and distortions from forming on the bonding zones,similar to that described above relating to continuous ribs.Furthermore, the present invention contemplates using both continuousribs and step portions on a single carrier tape to achieve the resultsdescribed above. For example, one continuous rib can be formedlongitudinally along one side of the carrier tape, and one step portioncan be formed longitudinally along the other side of the carrier tape.In this manner, both the continuous rib and step portion are used toprevent surface irregularities and distortions from forming on thebonding zones.

[0066]FIG. 5A illustrates a bottom perspective view and FIG. 5Billustrates a top perspective view of a carrier tape in accordance withthe third preferred embodiment of the present invention. The carriertape 302 includes advancement holes 308 and multiple pockets 304 forstoring and transporting components (not shown). The carrier tape 302also includes depressed portions 306 in between each of the pockets 304along the longitudinal direction. When depressed portions 306 arepresent, surface irregularities and distortions are minimized in thebonding zones 330 of the carrier tape in a manner similar to thatdescribed above. FIG. 6 illustrates a top perspective view of a carriertape in accordance with the fourth preferred embodiment of the presentinvention. The carrier tape 602 includes advancement holes 608 andmultiple pockets 604 for storing and transporting components. Thecarrier tape 602 also includes single sided (as shown) or double sidedtransitions or grooves 606 (those described above) formed intermittentlyalong the longitudinal direction of the carrier tape 602. Whenintermittent transitions/grooves 606 are present, surface irregularitiesand distortions are minimized in the bonding zones.

[0067] In the previous embodiments, the total force (F) required toremove the cover tape from the carrier tape can be represented by thefollowing formula: F=F₁(s) (bond strength per unit width as a functionof “s”)×W (width of bonding zone). In this formula, F, is dependent on aparameter “s”, which is related to the surface quality and topology onthe bonding zone. Thus, using the various surface transitions ordepressed regions in the carrier tape will reduce the surfacedistortions from forming on the bonding zone and subsequently makingF₁(s) more constant. In this manner, the surface transitions ordepressed regions will greatly reduce the adhesion strength variationsbetween the cover tape and the carrier tape.

[0068] It is to be understood that in the foregoing discussion andappended claims, the term “components” include any electronic ornon-electronic components such as integrated circuits, memory chips, orsemiconductor devices, etc.

[0069] In the previous descriptions, numerous specific details are setforth to provide a thorough understanding of the present invention.However, as one having ordinary skill in the art would recognize, thepresent invention can be practiced without resorting to the detailsspecifically set forth.

[0070] Although various preferred embodiments have been described indetail above, those skilled in the art will readily appreciate that manymodifications of the exemplary embodiments are possible withoutmaterially departing from the novel teachings and advantages of thisinvention.

I claim:
 1. An apparatus for storing a plurality of components,comprising: a carrier tape having: a plurality of pockets adapted toreceive the plurality of components, the plurality of pockets beingformed along a longitudinal direction of the carrier tape; a pair ofbonding zones, each bonding zone formed longitudinally along the outerperiphery of the carrier tape on opposite sides of the plurality ofpockets; a plurality of depressed portions, each depressed portionformed in between each of the plurality of the pockets along thelongitudinal direction of the carrier tape, and wherein the depressedportions assist in providing a substantially uniform surface havingminimal surface distortions on the pair of bonding zones; and a covertape adapted to cover the plurality of pockets and bonded to the carriertape at the pair of bonding zones such that the plurality of componentsare retained therein.
 2. The apparatus according to claim 1, wherein thecarrier tape further comprises a plurality of advancement holes formedlongitudinally adjacent to one of the pair of bonding zones.
 3. Theapparatus according to claim 1, wherein the carrier tape is made fromone of thermoplastic resin, polystyrene, and acrylonitrilebutadiene-styrene.
 4. The apparatus according to claim 1, wherein thecover tape is made from one of polyester, polypropylene, andpolyethylene.
 5. The apparatus according to claim 1, wherein the covertape is heat bonded to the carrier tape at the pair of bonding zones. 6.The apparatus according to claim 1, wherein the cover tape is bonded tothe pair of bonding zones with a substantially uniform tape releasetension along the longitudinal direction of the carrier tape.
 7. Asystem for packaging a plurality of components in a plurality of pocketsof a carrier tape, comprising; means for positioning the plurality ofcomponents in the plurality of pockets; means for sealing the pluralityof pockets using a cover tape, wherein the cover tape seals theplurality of pockets on bonding zones of the carrier tape; and means forminimizing the presence of surface distortions on the bonding zones,wherein the means for minimizing comprises forming a plurality ofdepressed portions in between the plurality of the pockets beforepositioning the plurality of components in the plurality of pockets,wherein the plurality of depressed portions assist in providing asubstantially uniform surface on the bonding zones.
 8. The systemaccording to claim 7, wherein the means for sealing the plurality ofpockets includes positioning the cover tape on the bonding zones in alongitudinal direction of the carrier tape.
 9. The system according toclaim 7, wherein the carrier tape further comprises a plurality ofadvancement holes formed longitudinally adjacent to one of the bondingzones.
 10. The system according to claim 7, wherein the plurality ofcomponents comprises one of semiconductor chips, devices, and integratedcircuits.
 11. The system according to claim 7, wherein the carrier tapeis made from one of thermoplastic resin, polystyrene, and acrylonitrilebutadiene-styrene.
 12. The system according to claim 7, wherein thecover tape is made from one of polyester, polypropylene, andpolyethylene.
 13. The system according to claim 7, wherein the means forsealing comprises heat bonding the cover tape to the carrier tape at thebonding zones.
 14. A method of manufacturing a carrier tape, the methodcomprising the steps of: identifying a pocket forming zone and a pair ofbonding zones, each of the pair of bonding zones being disposed in alongitudinal direction of the carrier tape on opposite sides of thepocket forming zone; forming a plurality of pockets and a plurality ofdepressed portions in the carrier tape within the pocket forming zonesuch that the presence of surface distortions on the bonding zones isminimal, each of the plurality of depressed portions disposed in thelongitudinal direction of the carrier tape in between each of theplurality of pockets.
 15. The method according to claim 14, wherein thestep of forming the plurality of pockets includes the step ofthermoforming the pockets.